Patent · US Expired

Method and apparatus for integrated wafer handling and testing

US6164894A · kind A · utility

381Cited by
33References
16Claims
0Family size

Inventor

Key dates

Filing dateNov 4, 1997
Grant dateDec 26, 2000
Priority date—
Expiry dateNov 4, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S414/141
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A wafer handling and testing apparatus and method include a station for supporting a wafer carrier, such as a cassette or pod, that holds one or more wafers, where the carrier can be moved in a z-direction. A wafer handling assembly is moveable in an x-direction and removes a wafer from the wafer carrier. The handling assembly includes an end effector and a sensor for detecting an edge of the wafer. A chuck includes a platform that is movable in a z-direction and is used to lift the wafer from the handling assembly and rotate the wafer so that the sensor maps the edge of the wafer. The wafer is then centered on the platform, lowered onto the chuck, and is tested by a test head that is preferably coupled to the handling assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.