David Cheng
53Patents
27h-index
40Co-inventors
88Inventor score
Filing activity: Aug 29, 1977 → Oct 30, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4951601A | Multi-chamber integrated process system | Emerging Cross-Sectional Technologies | 997 | Expired |
| US5882165A | Multiple chamber integrated process system | Electricity | 591 | Expired |
| US6164894A | Method and apparatus for integrated wafer handling and testing | Emerging Cross-Sectional Technologies | 381 | Expired |
| US5851299A | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions | Chemistry; Metallurgy | 359 | Expired |
| US5028565A | Process for CVD deposition of tungsten layer on semiconductor wafer | Emerging Cross-Sectional Technologies | 342 | Expired |
| US4842683A | Magnetic field-enhanced plasma etch reactor | Electricity | 303 | Expired |
| US5292393A | Multichamber integrated process system | Electricity | 286 | Expired |
| US4819167A | System and method for detecting the center of an integrated circuit wafer | Emerging Cross-Sectional Technologies | 192 | Expired |
| US5479108A | Method and apparatus for handling wafers | Emerging Cross-Sectional Technologies | 161 | Expired |
| US5215619A | Magnetic field-enhanced plasma etch reactor | Electricity | 132 | Expired |
| US5670888A | Method for transporting and testing wafers | Emerging Cross-Sectional Technologies | 130 | Expired |
| US5304248A | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions | Chemistry; Metallurgy | 116 | Expired |
| US5186594A | Dual cassette load lock | Emerging Cross-Sectional Technologies | 106 | Expired |
| US4911597A | Semiconductor processing system with robotic autoloader and load lock | Emerging Cross-Sectional Technologies | 106 | Expired |
| US5280983A | Semiconductor processing system with robotic autoloader and load lock | Emerging Cross-Sectional Technologies | 80 | Expired |
| US4668338A | Magnetron-enhanced plasma etching process | Electricity | 79 | Expired |
| US5546179A | Method and apparatus for mapping the edge and other characteristics of a workpiece | Physics | 75 | Expired |
| US4927485A | Laser interferometer system for monitoring and controlling IC processing | Physics | 49 | Expired |
| US6053688A | Method and apparatus for loading and unloading wafers from a wafer carrier | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6280581A | Method and apparatus for electroplating films on semiconductor wafers | Chemistry; Metallurgy | 46 | Expired |
| US5452078A | Method and apparatus for finding wafer index marks and centers | Electricity | 43 | Expired |
| US5160402A | Multi-channel plasma discharge endpoint detection method | Electricity | 39 | Expired |
| US5769588A | Dual cassette load lock | Emerging Cross-Sectional Technologies | 39 | Expired |
| US6454519B1 | Dual cassette load lock | Emerging Cross-Sectional Technologies | 38 | Expired |
| US5224809A | Semiconductor processing system with robotic autoloader and load lock | Emerging Cross-Sectional Technologies | 36 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.