Apparatus for preventing plasma etching of a wafer clamp in semiconductor fabrication processes
US6165276A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1999 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Sep 17, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4585
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for preventing plasma etching wafer clamp is disclosed in a process chamber. The apparatus comprises a pedestal, a bottom electrode, a wafer clamp, a semiconductor wafer, a quartz ring, a top electrode, a cooling plate, a anodize, and a gas hole. The wafer clamp is used to secure the semiconductor wafer. However, the wafer clamp includes a clamp ring, a concave holder, and a depression. The clamp ring is used to support the semiconductor wafer. The concave holder has a semi-elliptical surface, polymer being formed on the backside of the concave holder to prevent plasma etching in the deposition or etching process, into the clamp ring. Then The depression is designed, higher position, adjacent the concave holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.