Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
US6165617A · kind A · utility
7Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 1997 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Dec 31, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin-coated copper foil for use in a multilayer printed wiring board, characterized by having on one surface thereof a resin composition comprising, based on the total amount of the resin components, 50 to 90% by weight of epoxy resins, 5 to 20% by weight of a polyvinyl acetal resin, and 0.1 to 20% by weight of an urethane resin, with the proviso that 0.5 to 40% by weight of the epoxy resins is a rubber-modified epoxy resin; and a multilayer printed wiring board using the resin-coated copper foil therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.