Method of making components with solder balls
US6165885A · kind A · utility
167Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1998 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Jul 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component with solder ball connections is provided. A stencil is produced with holes passing through it in an arrangement corresponding to an arrangement of conductive pads on a substrate or integrated circuit. The stencil is made of a solder reflow compatible material. A layer of adhesive is applied to the stencil which is then positioned with the layer of adhesive adjacent the substrate or integrated circuit with the holes aligned with the conductive pads. Solder paste is deposited in the holes and is heated along with the conductive pads to form solder balls on the conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.