Process for sequential multi beam laser processing of materials
US6168744A · kind A · utility
6Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1997 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Oct 8, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/364
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.