Process for plating upon a polymeric surface
US6168836A · kind A · utility
3Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1998 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Oct 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process is disclosed for plating upon a polymeric surface with improved adhesion and coverage. The process comprises plating a metallic deposit upon a polymeric surface which has not been completely polymerized and then further curing the plated upon surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.