Flip chip pre-assembly underfill process
US6168972A · kind A · utility
56Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1998 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Dec 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulation process for flip-chip bonding chips to a substrate encapsulates solder balls on the chip in a separate encapsulation process in which the chip is coated with encapsulation layer and then a portion of the encapsulation layer is removed to expose a portion of the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.