Heat treatment apparatus and method, detecting temperatures at plural positions each different in depth in holding plate, and estimating temperature of surface of plate corresponding to detected result
US6169274A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 1, 1999 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Mar 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating element is disposed on a back face side of a holding plate, and a substrate mounted on the surface of the holding plate is designed to be heat-treated. In the holding plate, a hole having a bottom is provided from the back face toward the surface. At positions of different heights, a first temperature sensor and a second temperature sensor are disposed respectively. And a control section estimates the temperatures of the treatment position corresponding to detected results by the first temperature sensor and the second temperature sensor, controls heat energy to be supplied to the holding plate to control a heat treatment temperature of the substrate on the holding plate. Through the above formation, the temperature of the treatment position can be accurately estimated, the treatment position can reach a desired temperature within a short time, regardless of the temperature history, so that the time to treat the substrate at a desired treatment temperature can be made long.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.