Die attach pad adapted to reduce delamination stress and method of using same
US6169322A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1998 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Mar 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention enables a die to be attached to a die attach pad so as to reduce delamination stress that can arise when the die and die attach pad are heated, and so as to provide support for the die at locations where bond pads are formed so that the die is not damaged by forces applied to the die during attachment of bond wires to the bond pads. The die and die attach pad so attached can be used to produce a packaged die having improved delamination characteristics, so that the cost to manufacture and/or store the packaged die can be reduced. The invention further provides die attach pads and leadframes including such die attach pads that are particularly suited to achieving the aforementioned functional characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.