Patent · US Expired

Adhesive mixture suitable for mounting and demounting a semiconductor wafer

US6171385A · kind A · utility

4Cited by

4References

5Claims

0Family size

Assignee

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

Robert Rurlaender · Burgkirchen an der Alz, DE
Norbert Franze · Altötting, DE
Franz Mangs · Tittmoning, DE
Anton Schnegg · Burghausen, DE

Key dates

Filing date	Dec 8, 1998
Grant date	Jan 9, 2001
Priority date	—
Expiry date	Dec 8, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/07802
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of mounting and demounting a semiconductor wafer, in which a temperature dependent adhesive and curable joint is provided by an adhesive mixture between the semiconductor wafer and a carrier plate. The adhesive mixture contains a colophonium resin which is chemically modified and esterified. The cured joint is released with water again after polishing the semiconductor wafer. The adhesive mixture suitable for carrying out the method is this resin with an amine which saponifies the resin.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.