Franz Mangs
2Patents
2h-index
10Co-inventors
31Inventor score
Filing activity: Dec 9, 1997 → Dec 8, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5980361A | Method and device for polishing semiconductor wafers | Performing Operations; Transporting | 33 | Expired |
| US6171385A | Adhesive mixture suitable for mounting and demounting a semiconductor wafer | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.