Thermal conditioning apparatus
US6171402A · kind A · utility
4Cited by
43References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1999 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Feb 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of disposing a wafer on a support member protruding from a surface. The method includes supporting the wafer in a first position defined by a lift extending through the surface and manipulating the surface to place the wafer on the support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.