Cover tape for chip transportation and sealed structure
US6171672A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2839
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cover tape for chip transportation stuck to a surface of a carrier tape which has parts for accommodating chips formed intermittently in its lengthwise direction, to thereby seal the chip accommodating parts, wherein said cover tape comprises a tape-shaped substrate and pressure sensitive adhesive parts superimposed on one side of the tape-shaped substrate so that the pressure sensitive adhesive parts do not face the chip accommodating parts, PA1 the above pressure sensitive adhesive parts comprising a silicone pressure sensitive adhesive and a crosslinking agent (C) capable of crosslinking therewith, PA1 the above silicone pressure sensitive adhesive comprising: PA1 (A) a silicone resin component and PA1 (B) a silicone rubber component which contains a phenyl group. This cover tape for chip transportation enables avoiding a lifting/separation of cover tape from carrier tape caused by a difference in thermal shrinkage ratio when a polystyrene carrier tape is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.