Patent · US Expired

Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K-DRAMS using a disposable-oxide processing

US6171898A · kind A · utility

13Cited by
10References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 15, 1998
Grant dateJan 9, 2001
Priority date
Expiry dateDec 15, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/682

Abstract

A capacitor structure and method. The capacitor (12) comprises a HDC dielectric (40) and upper (44) and lower electrodes. The lower electrode comprises polysilicon(31-32), a diffusion barrier (34) on the polysilicon and an oxygen stable material (36) on the diffusion barrier (34). The oxygen stable material (36) is formed by first forming a disposable dielectric layer (50) patterned and etched to expose the area where the storage node is desired and then depositing the oxygen stable material (36). The oxygen stable material (36) is then either etched back or CMP processed using the disposable dielectric layer (50) as an endpoint. The disposable dielectric layer (50) is then removed. The HDC dielectric (40) is then formed adjacent the oxygen stable material (36).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.