Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K-DRAMS using a disposable-oxide processing
US6171898A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Dec 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/682
Abstract
A capacitor structure and method. The capacitor (12) comprises a HDC dielectric (40) and upper (44) and lower electrodes. The lower electrode comprises polysilicon(31-32), a diffusion barrier (34) on the polysilicon and an oxygen stable material (36) on the diffusion barrier (34). The oxygen stable material (36) is formed by first forming a disposable dielectric layer (50) patterned and etched to expose the area where the storage node is desired and then depositing the oxygen stable material (36). The oxygen stable material (36) is then either etched back or CMP processed using the disposable dielectric layer (50) as an endpoint. The disposable dielectric layer (50) is then removed. The HDC dielectric (40) is then formed adjacent the oxygen stable material (36).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.