Reworkable epoxy underfill encapsulants
US6172141A · kind A · utility
19Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1999 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Jan 7, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0008
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.