Lejun Wang
19Patents
8h-index
30Co-inventors
72Inventor score
Filing activity: Jan 7, 1999 → Mar 5, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6644536B2 | Solder reflow with microwave energy | Electricity | 31 | Expired |
| US6172141A | Reworkable epoxy underfill encapsulants | Chemistry; Metallurgy | 19 | Expired |
| US6570029B2 | No-flow reworkable epoxy underfills for flip-chip applications | Electricity | 15 | Expired |
| US6899960B2 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7359211B2 | Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7179684B2 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Emerging Cross-Sectional Technologies | 9 | Expired |
| US8750961B1 | Implantable medical device having a multi-axis magnetic sensor | Human Necessities | 9 | Active |
| US6498260B2 | Thermally degradable epoxy underfills for flip-chip applications | Electricity | 8 | Expired |
| US6730542B2 | Polybenzoxazine based wafer-level underfill material | Electricity | 8 | Expired |
| US8824161B2 | Integrated circuit packaging for implantable medical devices | Electricity | 7 | Active |
| US6727594B2 | Polybenzoxazine based wafer-level underfill material | Electricity | 4 | Expired |
| US9607759B2 | Implantable medical device including a molded planar transformer | Emerging Cross-Sectional Technologies | 1 | Active |
| US8133583B2 | Fire retardant antiflux fiber and its production process | Emerging Cross-Sectional Technologies | 0 | Active |
| US11844628B2 | Method of forming a transformer assembly | Emerging Cross-Sectional Technologies | 0 | Active |
| US7199342B2 | Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy | Electricity | 0 | Expired |
| US12083718B2 | Preparation method of high-rate foamed polylactic acid (PLA) sheet | Chemistry; Metallurgy | 0 | Active |
| US9496241B2 | Integrated circuit packaging for implantable medical devices | Electricity | 0 | Active |
| US11213690B2 | Wafer level packages of high voltage units for implantable medical devices | Electricity | 0 | Active |
| US12116703B2 | Method of preparing PAN-based carbon fibers | Textiles; Paper | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.