Rapid and accurate end point detection in a noisy environment
US6172756A · kind A · utility
107Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Dec 11, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0683
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for film measurement and endpoint detection in a noisy environment, such as CMP processing of semiconductor wafers, are disclosed, characterized by the use of spectral analysis of intensity data derived from light reflected off the sample to estimate film thickness or detect an endpoint condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.