"Organic substrate (PCB) slip plane ""stress deflector"" for flip chip devices"
US6173489A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1998 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Feb 27, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to "float" and expand at a different rate than the substrate when the package is thermally cycled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.