Co-axial bellows liquid heatsink for high power module test
US6173760A · kind A · utility
13Cited by
15References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1998 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Aug 4, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for controlling the temperature an electronic component. The system includes a block for temporarily engaging a surface of the component. The block includes channels for circulating a temperature controlling fluid to control a temperature the block and the attached component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.