Method and apparatus for machining a cavity in a smart card
US6174113A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 1999 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Feb 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/307224
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A machining method is provided for use with a smart card of the type having at least one conducting winding at some distance from the opposed faces of the card, with the end portions of the winding forming electrical connection pads for an electronic chip. According to the method, an electric potential is generated in the winding. The milling tool is made to orthogonally penetrate the card in a region of at least one of the pads, and the electric potential of the milling tool is concomitantly monitored to detect a variation in electric potential that identifies a reference position of the milling tool with respect to the card and pad. The penetration of the milling tool is continued for a predetermined travel from the reference position so as to reach a machining position. In one preferred method, the milling tool is moved parallel to the card at the depth of the machining position in order to form a cavity in the smart card. A machining apparatus for machining a cavity in a smart card is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.