High density Z-axis connector
US6174175A · kind A · utility
17Cited by
17References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1999 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Apr 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connector or interposer for making connection in a high density device electronic environment. The connector is made of a high density array of nickel columns held in a layer of polyimide with each column extending beyond the opposing surfaces of said layer of polyimide. The connector may be used to make temporary or permanent connection to electrical contacts without alignment. Connection may be accomplished by loading forces sufficient to form either an indentation or a penetration of solder ball contacts. Contact to a single chip or a full wafer of chips is facilitated for testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.