Charles H. Perry
48Patents
19h-index
120Co-inventors
84Inventor score
Filing activity: Jun 15, 1984 → May 8, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6528145B1 | Polymer and ceramic composite electronic substrates | Emerging Cross-Sectional Technologies | 118 | Expired |
| US5600257A | Semiconductor wafer test and burn-in | Physics | 114 | Expired |
| US5130067A | Method and means for co-sintering ceramic/metal MLC substrates | Electricity | 113 | Expired |
| US5629631A | Interface card for a probe card assembly | Physics | 86 | Expired |
| US6275051A | Segmented architecture for wafer test and burn-in | Physics | 73 | Expired |
| US6351134B2 | Semiconductor wafer test and burn-in | Physics | 69 | Expired |
| US5530371A | Probe card assembly | Physics | 69 | Expired |
| US5532608A | Ceramic probe card and method for reducing leakage current | Physics | 67 | Expired |
| US5546012A | Probe card assembly having a ceramic probe card | Physics | 64 | Expired |
| US5976710A | Low TCE polyimides as improved insulator in multilayer interconnect structures | Emerging Cross-Sectional Technologies | 54 | Expired |
| US5929651A | Semiconductor wafer test and burn-in | Physics | 48 | Expired |
| US5977787A | Large area multiple-chip probe assembly and method of making the same | Physics | 42 | Expired |
| US5260519A | Multilayer ceramic substrate with graded vias | Electricity | 29 | Expired |
| US6404211B2 | Metal buckling beam probe | Physics | 29 | Expired |
| US6529021B1 | Self-scrub buckling beam probe | Physics | 28 | Expired |
| US6020750A | Wafer test and burn-in platform using ceramic tile supports | Physics | 25 | Expired |
| US6458623B1 | Conductive adhesive interconnection with insulating polymer carrier | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6548175B2 | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof | Emerging Cross-Sectional Technologies | 20 | Expired |
| US4781970A | Strengthening a ceramic by post sinter coating with a compressive surface layer | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5135595A | Process for fabricating a low dielectric composite substrate | Electricity | 19 | Expired |
| US6174175A | High density Z-axis connector | Electricity | 17 | Expired |
| US5139852A | Low dielectric composite substrate | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5398923A | One-way winch brake | Mechanical Engineering; Lighting; Heating | 16 | Expired |
| US6711810B2 | Method of assembling a land grid array module | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5293504A | Multilayer ceramic substrate with capped vias | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.