Corrosion and dissolution protection of a conductive silver/polymer composite
US6174606A · kind A · utility
10Cited by
1References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1997 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Nov 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive composite is described containing silver particles and a polymer which covers each silver particle and wherein a heterocyclic organic compound containing nitrogen such as benzotriazole (BTA) is present to reduce Ag dissolution and ion mobility by forming a water insoluble complex with the Ag ion. The invention overcomes the problem of silver dissolution or corrosion a conductive composite as a result of normal high Ag ion mobility in the presence of moisture and an electric field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.