Sintered aluminum nitride body and metallized substrate prepared therefrom
US6174614A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1998 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Oct 26, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B41/89
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A sintered aluminum nitride body comprising aluminum nitride as the main component and containing a calcium compound, an ytterbium compound, and a neodymium compound. Due to the use of the above calcium-yttrium-neodymium ternary sintering aid, the sintered aluminum nitride body can be obtained by firing a compact of the raw material powder at a low temperature after degreasing the compact without cracking and has evenness of in color, strength and thermal conductivity. The sintered aluminum nitride body provides an inexpensive, high-quality metallized substrate for electronic parts by forming a high-melting metallizing layer of W and/or Mo. Onto the aluminum nitride body, an Ag metallizing layer including oxides of Zn and Cu or an Ag-Pd metallilzing layer including oxides of B, Pb, Cr and Ca and, if necessary, further an insulating vitreous layer may be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.