Metallization process and component
US6174647A · kind A · utility
10Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1998 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Jan 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention is directed to a process for the selective metallization which utilizes multiple photoresist layers, using a buried palladium ligand which is then catalyzed using a PdBr selective catalyst. The Pd in the catalyst is then reduced to Pd.sup.0 and metallized using for example electroless copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.