Methods of forming a barrier layer
US6174823A · kind A · utility
7Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1997 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Nov 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76843
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to methods of forming a barrier layer including depositing a layer of Titanium Nitride and subsequently nitriding the surface of that layer. In some embodiments the Titanium Nitride layer is exposed to Oxygen prior to the nitroding step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.