Laminated electroplating rack and connection system for optimized plating
US6176985A · kind A · utility
22Cited by
22References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Oct 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroplating apparatus provides high current electrical connections in a small area to a workpiece. The contact area may use a dendrite surface to improve the connection. An insulative gasket prevents electroplating fluids from entering the region about the contact area. A heavy core laminated within a supporting structure provides uniform current distribution of high electrical currents to the dendrite covered contact areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.