CMP slurry containing a solid catalyst
US6177026A · kind A · utility
43Cited by
21References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | May 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing composition comprising an oxidizing agent and at least one solid catalyst, the composition being useful when combined with an abrasive or with an abrasive pad to remove multiple metal layers from a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.