Method of making an interface layer for stacked lamination sizing and sintering
US6177184A · kind A · utility
3Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Aug 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31942
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.