Ion extraction process for single side wafers
US6177279A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Nov 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/25125
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for extracting inorganic ionic contaminants from a front surface of a silicon wafer for chemical analysis. The wafer is placed in a container upon a support which holds the wafer in a generally level orientation and isolates the wafer to inhibit air circulation over the front surface. Air circulation can introduce contaminants to the extraction fluid, causing a false measurement of contaminants on the wafer. A layer of extraction fluid is deposited upon only the front surface of the wafer and held for a period of time so that contaminants on the front surface are extracted into the layer of fluid. A portion of the layer of fluid is collected by a sampling device for subsequent analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.