Method of forming metallic fuse demanding lower laser power for circuit repair
US6177297A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1999 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Jan 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved formation method produces a metallic fuse capable of lowering the laser power needed for carrying out circuit repair. The method includes forming a metallic fuse when the penultimate metallic layer is formed. Since the metallic fuse is not too far away from the top surface, the power of the laser beam necessary for repairing the circuit can be moderate. Furthermore, the laser beam is more focused because it travels a shorter distance to reach the fuse, thereby avoiding unnecessary dispersion through intermediate material. Moreover, since the metallic fuse itself is not too thick, only a low-power laser beam is needed to melt the metallic fuse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.