Connection components with posts
US6177636A · kind A · utility
233Cited by
17References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 1997 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Jun 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A subtractively created interconnection scheme and apparatus, typically used with microelectronic devices, wherein a flexible support structure is attached to a conductive sheet. The conductive sheet is then selectively removed, preferably using an etching process, thereby producing a plurality of posts with tips which are substantially coplanar with respect to one another. Each post becoming an individual interconnection between the microelectronic device and a supporting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.