Information handling system with circuit assembly having holes filled with filler material
US6178093A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Mar 3, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An information handling system is provided which comprises: PA1 a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer, wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling sa…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.