Polishing method and apparatus
US6180020A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1998 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Mar 12, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.