Patent · US Expired

Method for producing a contactless chip card

US6180434A · kind A · utility

2Cited by

9References

2Claims

0Family size

Assignees

Elke Zakel · DE
Smart Pac GmbH Technology Services · DE

Inventors

Martin Lange · Berlin, DE
Ghassem Azdasht · Berlin, DE

Key dates

Filing date	Apr 13, 1999
Grant date	Jan 30, 2001
Priority date	—
Expiry date	Apr 13, 2019

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/07749
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method of producing a contactless chip card (10) includes first the step of holding a chip (14), which is provided with terminal pads (16a, 16b) on a surface thereof, in a mould defining a chip-card substrate (12), in such a way that the chip surface provided with the terminal pads is located substantially in the same plane as a chip-card substrate surface defined by the mould. In addition, a chip-card substrate material is introduced into the mould, whereupon a coil structure (18) is applied by screen-printing a conductive paste onto the chip-card substrate (12) in such a way that the coil structure (18) extends up to the terminal pads (16a, 16b) on the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.