Smart Pac GmbH Technology Services
12Patents
3Active
12Granted
32Portfolio score
Filing activity: Apr 13, 1999 → Sep 24, 2009 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6651891B1 | Method for producing contactless chip cards and corresponding contactless chip card | Electricity | 41 | Expired |
| US6713714B1 | Method and device for thermally connecting the contact surfaces of two substrates | Electricity | 23 | Expired |
| US8328068B2 | Transfer device for receiving and transferring a solder ball arrangement | Electricity | 4 | Active |
| US6407457B1 | Contact-bumpless chip contacting method and an electronic circuit produced by said method | Electricity | 3 | Expired |
| US7360679B2 | Method for the production of a soldered connection | Electricity | 2 | Expired |
| US6180434A | Method for producing a contactless chip card | Physics | 2 | Expired |
| US7106599B2 | Chip module and chip card module for producing a chip card | Electricity | 1 | Expired |
| US6642727B1 | Chip carrier device and method for the production of a chip carrier device with an electrical test | Electricity | 1 | Expired |
| US7762446B2 | Method and device for transferring a solder deposit configuration | Electricity | 1 | Expired |
| US7926699B2 | Method and device for transferring a solder deposit configuration | Electricity | 0 | Active |
| US7726543B2 | Method for the production of a soldered joint | Electricity | 0 | Active |
| US7049213B2 | Method for producing a contact substrate and corresponding contact substrate | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.