Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards
US6182884A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1998 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Dec 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A nozzle is provided for the reworking of printed circuit boards with CBGA and CCGA solder containing chips comprising a housing having an internal hot gas chamber and configured to hold at the lower end of the nozzle a chip to be attached to the printed circuit board. The nozzle is provided with a support member and resilient means on the lower surface thereof which resilient means contacts the upper surface of the chip when the chip is placed in the nozzle. When a vacuum is applied to the nozzle the chip is held against the resilient means and compresses the resilient means so that the lower portion of the solder array is below the lower end of the nozzle. When the nozzle is then placed against a printed circuit board, the resilient means provides a pressure force against the chip and the printed circuit board which enables rework of the printed circuit board even though the printed circuit board may be warped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.