Apparatus for depositing thin films on semiconductor wafers
US6183563A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 1999 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | May 18, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for depositing thin films on a semiconductor wafer. The thin film deposition apparatus includes a reactor block receiving a semiconductor wafer; a shower head plate covering the reactor block to maintain the internal pressure of the reactor block at a predetermined level; a reaction gas supply connected to the shower head plate, for supplying reaction gases; an inert gas supply connected to the shower head plate, for supplying an inert gas; an exhaust portion connected to the reactor block, for exhausting the gases out of the reactor block; and a diffusion plate installed in the shower head plate, having a plurality of passages connected to the source of inert gas supply, a plurality of nozzles connected to the passages, the inert gas sprayed through the nozzles lowering a wall of inert gas along the inner wall of the reactor block, and a plurality of spray holes, the reaction gases spread over the wafer through the spray holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.