Packaging and interconnection of contact structure
US6184576A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1998 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Sep 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A packaging and interconnection for connecting a contact structure to an outer peripheral component with a short signal pass length to achieve a high frequency operation. The packaging and interconnection is formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is extended toward an edge of the contact substrate, a connection target provided at an outer periphery of the contact structure to be electrically connected with the other end of the contact trace, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between for supporting the contact structure, the contact substrate and the elastomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.