Constraining ring for use in electronic packaging
US6184589A · kind A · utility
21Cited by
22References
7Claims
0Family size
Inventors
Key dates
| Filing date | Nov 18, 1998 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Nov 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A constraining ring increases the modulus of an interconnect substrate to maintain flatness of the substrate. The constraining ring is made of materials selected to match the coefficient of thermal expansion of the substrate to that of the constraining ring. Circuit components including capacitors and resistors are formed on the constraining ring to provide enhanced electrical properties without adding to the size of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.