Cooling system for test head
US6184676A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1999 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Mar 12, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A test head for a semiconductor integrated circuit tester comprises a housing which has an air inlet opening and an air outlet opening and bounds a pin card space and an air chamber. Multiple pin cards are located in the pin card space and radiate from an interior cavity which is within the pin card space. A baffle structure divides the air chamber, which is separated from the pin card space by a boundary surface, into an air supply duct which provides communication between the air inlet opening and the interior cavity and an outlet plenum which provides communication between the pin card space and the air outlet opening by way of the boundary surface. A fan is mounted in the interior cavity for inducing a flow of air from the interior cavity to the plenum by way of spaces between the pin cards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.