Apparatus for the simultaneous deposition by physical vapor deposition and chemical vapor deposition and method therefor
US6186090A · kind A · utility
47Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Mar 4, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and method for the vacuum deposition of at least two different layers of thin film material onto a substrate by two different vacuum deposition processes. Also disclosed is a novel linear applicator for using microwave enhanced CVD to uniformly deposit a thin film of material over an elongated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.