Apparatus and method for performing end point detection on a linear planarization tool
US6186865A · kind A · utility
25Cited by
20References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1998 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Oct 29, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.