Patent · US Expired

Wafer edge cleaning

US6186873A · kind A · utility

15Cited by

6References

14Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Kent R. Becker · Saint Albans, US
Stuart D. Cheney · South Burlington, US
Scott R. Cline · Belle Plaine, US
Paul A. Manfredi · Waterbury Center, US
Eric J. White · Vergennes, US

Key dates

Filing date	Apr 14, 2000
Grant date	Feb 13, 2001
Priority date	—
Expiry date	Apr 14, 2020

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B9/065
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

In a chemical mechanical polishing process for planarization of semiconductor wafers, a pair of opposed grippers are used to move the wafer from one station to another. During this movement, the wafer is rotated and brushes along the periphery are placed in contact with the edge of the wafer to remove foreign material and residue which builds up along the edge of the wafer. Cleaning fluid may be introduced to flush away and/or breakup the residue buildup.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.