Multilayer ceramic substrate with anchored pad
US6187418A · kind A · utility
15Cited by
5References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Jul 19, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to an inner pad of the multilayer ceramic substrate by either a plurality of vias or one large via. The outer pad and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.