Scott I. Langenthal
12Patents
8h-index
24Co-inventors
64Inventor score
Filing activity: Sep 16, 1998 → May 1, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6136419A | Ceramic substrate having a sealed layer | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6139666A | Method for producing ceramic surfaces with easily removable contact sheets | Electricity | 42 | Expired |
| US6529021B1 | Self-scrub buckling beam probe | Physics | 28 | Expired |
| US6184062A | Process for forming cone shaped solder for chip interconnection | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6220499A | Method for assembling a chip carrier to a semiconductor device | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6312791A | Multilayer ceramic substrate with anchored pad | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6559527B2 | Process for forming cone shaped solder for chip interconnection | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6187418A | Multilayer ceramic substrate with anchored pad | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6984792B2 | Dielectric interposer for chip to substrate soldering | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6258191A | Method and materials for increasing the strength of crystalline ceramic | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6657313B1 | Dielectric interposer for chip to substrate soldering | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6376054B1 | Surface metallization structure for multiple chip test and burn-in | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.