Method of fabrication of multiple-layer high density substrate
US6187652A · kind A · utility
82Cited by
20References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1998 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Sep 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4623
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a multi-layer interconnected substrate structure. The inventive method includes forming a multi-layer structure from multiple, pre-fabricated power and/or signal substrates which are laminated together. A drill is then used to form a via through the surface of a ring-type pad down to a desired depth in the multi-layer structure. The via hole is cleaned and then filled with a conductive material. The via so formed between two or more substrates is self-aligned by using the ring pad(s). This contributes to an increased signal routing density compared to conventional methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.