Bond pad for a flip chip package, and method of forming the same
US6187658A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2000 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Feb 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond pad support structure is located beneath a bond pad on an integrated circuit. The bond pad support structure includes a first bond pad support layer at least partly located below the bond pad. The first bond pad support layer has a plurality of radial patterns with at least one space between the radial patterns. The radial patterns may be, for example, straight lines having approximately uniform thickness. Alternatively, the radial patterns may be triangles, each of which has an apex pointing to the center of a region below the bond pad. The radial patterns may have a plurality of different lengths. A second bond pad support layer is located on the first bond pad support layer. The second bond pad support layer fills at least a portion of the space between the radial patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.