Method/structure for creating aluminum wirebound pad on copper BEOL
US6187680A · kind A · utility
196Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1998 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Oct 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the IC structure which contain or do not contain an underlying region of Cu wiring. The present invention also provides a method of interconnecting the fabricated structure to a semiconducting packaging material through the use of a wirebond or Controlled Collapse Chip Connection (C4) solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.